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W Achtziger , University of Dortmund , Germany
G Allaire , Ecole Polytechnique , France
G Ananthasuresh , Indian Institute of Science , India
J Arora , University of Iowa , USA
K Bletzinger , Technical University of Munich , Germany
J Cardoso , IST- TU Lisbon , Portugal
G Cheng , Dalian University of Technology , China
A Cherkaev , University of Utah , USA
D Choi , Hanyang University , Korea
C Cinquini , University of Pavia , Italy
A Conceição , University of Porto , Portugal
P Duysinx , University of Liège , Belgium
P Eberhard , University of Stuttgart , Germany
G Fadel , Clemson University , USA
C Fleury , University of Liège , Belgium
M Fuchs , Tel Aviv University , Israel
R Grandhi , Wright State University , USA
A Groenwold , University of Stellenbosch , South Africa
Z Gurdal , Delft University of Technology , Netherlands
S Gutierrez , Un. Catolica de Chile , Chile
W Gutkowski , Polish Academy of Sciences , Poland
R Haber , University of Ilinois , USA
R Haftka , University of Florida , USA
P Hajela , Rensselaer Polytechnic Institute , USA
K Jármai , University of Miskolc , Hungary
H Jensen, Santa Maria University, Chile
S Kaliszky , Hungaria Academy of Sciences , Hungary
F Keulen , Delft University of Technology , Netherlands
N Kikuchi , University of Michigan , USA
Y Kim , Seoul National University , Korea
A Klarbring , Linköpings Universitet , Sweden
M Kocvara , University of Birminghan , UK
J Koski , Tampere University of Technology , Finland
J Lellep , Tartu University , Estonia
T Lewinski , Warsaw University of Technology , Poland
R Lipton , Louisiana State University , USA
S Liu , Dalian University of Technology , China
J Lógó , Budapest University of Technology and Economics , Hungary
J Madeira , IDMEC-IST , Portugal
J Martins , University of Toronto , Canada
A Messac , Rensselaer Polytechnic Institute , USA
S Nagendra , United Technologies Corp. , USA
S Nishiwaki , Kyoto University , Japan
A Novotny , LNCC , Brasil
N Olhoff , Aalborg University , Denmark
M Papadrakakis , National Technical University of Athens , Greece
P Papalambros , University of Michigan , USA
G Park , Hanyang University , Korea
P Pedersen , Technical University of Denmark , Denmark
O Querin , University of Leeds , UK
R Rikards , Riga Technical Univesity , Latvia
A Seyranian , Moscow State University , Russia
J Sienz , Swansea University , UK
O Sigmund , Technical University of Denmark , Denmark
E Silva , University of S. Paulo , Brasil
M Silvana , Federal Univesity of Pernambuco , Brasil
L Simões , University of Coimbra , Portugal
C Soares , IST- Tu Lisbon , Portugal
M Stolpe , Technical University of Denmark , Denmark
K Svanberg , Royal Institute of Technology , Sweden
A Toader , Lisbon University , Portugal
V Toropov , University of Leeds , UK
D Tortorelli , University of Ilinois , USA
L Vicente , University of Coimbra , Portugal
M Wang , Chinese University of Hong Kong , China
R Yang , Ford Motor Company , USA
H Yamakawa, Waseda Un. Tokyo, Japan
M Yoshimura , Kyoto University , Japan
M Zhou , Altair Computing Inc. , USA
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